Credo Technology Group Holding Ltd
$CRDORising on XNASDAQAdvanced Packaging & AI Interconnect
62Posts · 1D
58Authors
+48%Vs prior 1D
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6 tickers shownAdvanced Packaging & AI Interconnect
Filtered locallyTaiwan Semiconductor Manufacturing Company Ltd.
$TSMRising on XNYSEAdvanced Packaging & AI InterconnectSemiconductor Onshoring
117Posts · 1D
91Authors
+58%Vs prior 1D
→TSMC reportedly plans to raise CoWoS advanced packaging prices by 10-20% as demand spreads from GPUs to CPUs and ASICs. Supply chain sources indicate buyers have stopped negotiating, with equipment lead times stretching to eight months.
Research →Astera Labs, Inc.
$ALABRising on XNASDAQAdvanced Packaging & AI Interconnect
24Posts · 1D
21Authors
+41%Vs prior 1D
→Amkor Technology, Inc.
$AMKRCoolingNASDAQAdvanced Packaging & AI InterconnectSemiconductor Onshoring
20Posts · 1D
17Authors
-35%Vs prior 1D
→Amkor reported Q3 sales of $1.991B with computing mix rising to 26% and gross margin expanding to 18.3%. Advanced packaging capacity expansion is reportedly underway amid broader AI demand.
Research →ASE Technology Holding Co., Ltd. American Depositary Shares (each representing Two Common Shares)
$ASXRising on XNYSEAdvanced Packaging & AI Interconnect
13Posts · 1D
11Authors
+30%Vs prior 1D
→ChipMOS TECHNOLOGIES INC. - American Depositary Shares
$IMOSHot on XNASDAQAdvanced Packaging & AI Interconnect
3Posts · 1D
3Authors
+200%Vs prior 1D
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