Amkor Technology, Inc.
$AMKRHot on XNASDAQAdvanced Packaging & AI Interconnect
60Posts · 3D
54Authors
+107%Vs prior 3D
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6 tickers shownAdvanced Packaging & AI Interconnect
Filtered locallyValens Semiconductor Ltd.
$VLNHot on XNYSEAdvanced Packaging & AI Interconnect
23Posts · 3D
14Authors
+283%Vs prior 3D
→Taiwan Semiconductor Manufacturing Company Ltd.
$TSMRising on XNYSEAdvanced Packaging & AI InterconnectSemiconductor Onshoring
233Posts · 3D
159Authors
+27%Vs prior 3D
→TSMC reportedly plans to raise CoWoS advanced packaging prices by 10-20% as demand spreads from GPUs to CPUs and ASICs. Supply chain sources indicate buyers have stopped negotiating, with equipment lead times stretching to eight months.
Research →Credo Technology Group Holding Ltd
$CRDOActive on XNASDAQAdvanced Packaging & AI Interconnect
127Posts · 3D
97Authors
-7%Vs prior 3D
→Astera Labs, Inc.
$ALABActive on XNASDAQAdvanced Packaging & AI Interconnect
58Posts · 3D
44Authors
-21%Vs prior 3D
→ASE Technology Holding Co., Ltd. American Depositary Shares (each representing Two Common Shares)
$ASXActive on XNYSEAdvanced Packaging & AI Interconnect
29Posts · 3D
21Authors
+7%Vs prior 3D
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